• Individual
temperature control for each device under test up to
150-watts.
• Individual
device thermal control within ± 5 ° C.
• 128 I/O channels per driver/receiver.
• Programmable temperature control up to 150° C.
• 11 programmable voltage regulators per burn-in board.
• 800 amps of DUT power available per burn-in board.
• ASIC architecture for per-pin timing, testing, and formatting of pattern
data.
• 8 on-the-fly timing sets.
• System capacity up to 384 devices.
