• Provides burn-in for a variety of device
types, including flash memory devices, DRAMs, SRAMs and
medium-power logic devices.
• Optional individual temperature control for each device under test up
to 20 W.
• Large
system capacity (64 burn-in boards).
• 128 digital I/O channels per burn-in board.
• Per-pin
timing, testing, and formatting.
• Accepts burn-in boards up to 12 1/2" by
24".
• 16
pattern zones.
• Up
to 60 amps of programmable power to the burn-in board.
• Up to 120 amps of programmable power to the burn-in
board (HPB-1 option).
