Selecting Heat Sinks and Heaters for the HPB-5A/HPB-5BThis application note is intended as an aid in the selection of appropriate sockets and heat sinks for devices in the HPB-5A/HPB-5B. The thermal dissipation of the device under test (DUT) to the heat sink and heat sink to air is critical in determining the maximum power levels that can be used during test. The HPB-5A/5B can regulate the temperature of each device under test, ensuring that it is properly stressed. After reading this application note, the reader will have a better understanding of the heat sink requirements for the HPB-5A/5B High Power Burn-In Systems manufactured by Micro Control Company. To aid in this understanding, the following topics will be discussed:
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