Burn-In Boards
Micro Control Company designs and manufactures burn-in boards for use during burn-in and testing of a wide variety of electronic devices for many different types of burn-in systems. Each burn-in board is designed by engineers specializing in burn-in board design and can be formulated to meet the customer’s specific application requirements and specifications.
Burn-In Boards
Features:
- Dedicated and universal board designs
- 2 to 34 layers
- Gold-plated edge connectors
- 200°C maximum temperature
- All burn-in board styles available
- BGA, LGA, PGA, QFP, TSOP, micro-BGA, SOJ, PLCC, DIP, or custom-designed sockets
- -55°C to +150°C temperature range (up to 250°C with special board materials)
- Loader/unloader compatibility
Services:
- Design, layout, and test for burn-in boards of all types, sizes, and complexities
- Prototype to production quantities
- Engineering support for designs of all complexities
- Mechanical design for custom heatsinks
- Vector development available
