Features:

  • Individual temperature control for each device up to 600 W
  • Test devices at a maximum temperature of 150°C with a liquid-cooled heat-sink per device.
  • Programmable clocks with leading and trailing edges per pin, one-nanosecond resolution, and 8 on-the-fly timing sets.
  • System capacity of 14 burn-in boards (112 devices)
  • 12 vector formats per-pin per-cycle with memory testing extensions
  • 128 I/O signals per board
  • High-speed clock range of 2 to 400 MHz
  • 64M vector memory, 8G scan
  • 19 programmable voltage regulators provide 2060 amps of device current per burn-in board
  • 16 high-current supplies
    • (0-3.2 Volts up to 125 Amps each)
  • 3 low-current supplies
    • (0-6 Volts up to 20 Amps each)

Benefits:

  • Testing capabilities for high-power devices
  • Ensures proper thermal stress for each device
  • Measures device temperature more accurately
  • Testing is more cost-effective due to greater system capacity resulting in higher throughputs
  • Exercise and test high pin count devices or more parts in parallel
  • Run large numbers of test vectors without time-consuming reloads
  • Up to 2000 Watts of device under test power available per slot
  • Translate and run device test programs
  • Clock devices with built-in self-test (BIST) at high speed
  • Flexibility to test complex devices