Burn-In Boards

Micro Control Company designs and manufactures burn-in boards for use during burn-in and testing of a wide variety of electronic devices for many different types of burn-in systems. Each burn-in board is designed by engineers specializing in burn-in board design and can be formulated to meet the customer’s specific application requirements and specifications.

Burn in board

Burn-In Boards


  • Dedicated and universal board designs
  • 2 to 22+ layers of polymide
  • 200°C maximum temperature
  • Gold-plated connectors and socket lands
  • All burn-in board styles available
  • BGA, LGA, PGA, QFP, TSOP, micro-BGA, SOJ, PLCC, DIP, or custom-designed sockets
  • -55°C to +150°C temperature range (up to 250°C with special board materials)
  • Loader/unloader compatibility


  • Design, layout, and test for burn-in boards of all types, sizes, and complexities
  • Prototype to production quantities
  • Engineering support for designs of all complexities
  • Mechanical design for custom heatsinks
  • Vector development available

Request Literature on Burn-In Boards