• Dedicated and universal board designs
  • 2 to 22+ layers of polymide
  • 200°C maximum temperature
  • Gold-plated connectors and socket lands
  • All burn-in board styles available
  • BGA, LGA, PGA, QFP, TSOP, micro-BGA, SOJ, PLCC, DIP, or custom-designed sockets
  • -55°C to +150°C temperature range (up to 250°C with special board materials)
  • Tin-lead or tin-silver wave soldering
  • Loader/unloader compatibility

Micro Control Company
Micro Control Company offers solutions for high-power burn-in test applications requiring individual temperature control and logic/memory burn-in test applications for lower power devices.
7956 Main Street NE
Minneapolis, MN
Phone: 1-800-328-9923


  • Design, layout, and test for burn-in boards of all types, sizes, and complexities
  • Prototype to Production quantities
  • Engineering support for designs of all complexities
  • Mechanical design for custom heatsinks
  • Vector development available