High-Power Burn-In with Test System
The HPB-5C meets the challenges created by the diverse burn-in needs of devices in a medium power range (up to 150W). Providing individual temperature control at the device level allows each device under test to be held at a precise temperature (±5°C) while supporting a wide range of test strategies. If individual temperature control is not required, more devices can be burned in with test during a burn-in cycle.
| Target DUT Wattage | 150W |
| Available Power | 16 supplies, 1,064A, 2,480W |
| Max Power per BIB | 2,000W |
| High-Current Regulators | 8 per BIB — 250W, 125A, 0.0V–6.0V |
| Low-Current Regulators | 8 per BIB — 60W, 10A, 0.0V–6.14V |
| Vector Memory Depth | 32M standard, 64M optional |
| Scan Mode Rep-Rate | Up to 10MHz |
| High-Frequency Clocks | 1 clock, up to 800MHz, LVDS |
| BIB Slots | 16 |
| Pattern Zones | Up to 16 |
| I/O Channels | 128 formatted digital per BIB, plus 24 chip selects |
| Test Resolution | 2.0 ns (8 on-the-fly timing sets) |
| Temp Channels per BIB | 24 individual |
| System DUT Capacity | 384 temperature-controlled DUTs |
| Temperature Limit | 150°C per DUT |
| Socket Cooling | Controlled airflow with heater per DUT |
The HPB-5 family has been a trusted industry favorite for 20+ years because it adapts easily to a wide variety of testing demands. It became the best-selling burn-in with test system by delivering consistent, long-term reliability that manufacturers have counted on for over two decades. Capable of testing devices from 0W to 150+W, the HPB-5C gives maximum flexibility for people looking for high-variety parts. Whether you are testing older devices or shifting to newer devices with more complex requirements, this system provides the flexibility and performance needed to keep your production floor moving forward. It remains the top choice for many testing facilities worldwide because it gets the job done year after year.
Designed by engineers and PCB designers experienced in multi-layer board layouts. Each HPB-5C board is designed for the device under test and the customer's specific requirements. The device size and complexity determine how many devices fit per board.
A single-board (one-slot) system with the same test electronics and device cooling as a full HPB-5C. Primarily used for test development and board troubleshooting.
A mobile cart for transporting BIBs. Carts insure that high-value boards are secure in transit and reduces manual handling.
Individual automation modules that run on their own or attach to a single system, a way to add automated handling without committing to a full line. A flexible entry point that can grow into the complete setup.
Compare up to three Micro Control solutions to quickly narrow your options and identify which burn-in system best aligns with your device requirements, testing environment, and performance goals.
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Burn-in with Individual temperature control (ITC) is the most important development in burn-in technology.
Burn-in is the process that applies elevated temperatures and high voltages to accelerate conditions that will stress semiconductors during what is known as their infant mortality period.
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