Custom-designed burn-in boards built for signal integrity, thermal stability, and repeatable results on the HPB-8. Engineered around your device by Micro Control’s experienced PCB design team, with liquid-cooled, high-power sockets supporting up to 12 devices with individual temperature control.
| PCB Size | Two socket boards connect to BIB; each board 23” x 11.8” (584.2mm x 299.7mm) |
| DUT Area / User Space | 547 sq in per BIB |
| Number of Devices | 12 with ITC |
| Sockets | Liquid-cooled, high-power |
| Cooling Method | Chiller-cooled water |
Micro Control's most powerful burn-in with test system, with individual temperature control per device and capacity for devices over 2,000 watts. Built as a standalone automation solution for AI, automotive, and advanced semiconductor production.
A single-board (one-slot) system with the same test electronics and device cooling as a full HPB-8. Primarily used for test development and board troubleshooting.
A powered workstation for moving BIB and regulator assemblies between your HPB-8 systems and EDS. The powered lift aligns to slot height and docks directly to the system, reducing manual handling.
A connected complete setup of automated loading, mobile robotics, and burn-in systems working as one. Cross platform software synchronizes every handoff, scaling from a single cell to full production.
Burn-in with Individual temperature control (ITC) is the most important development in burn-in technology.
Burn-in is the process that applies elevated temperatures and high voltages to accelerate conditions that will stress semiconductors during what is known as their infant mortality period.
Get The Complete Turnkey Solution For The HPB-8
