In addition to Micro Control’s second-to-none HPB-6 solution, we build custom-designed burn-in boards built for this platform that properly support signal integrity, thermal stability, and repeatable results you need for optimal testing. Engineered around your device by Micro Control’s experienced PCB design team, with water-cooled, high-force sockets supporting up to 12 devices with individual temperature control.
| PCB Size | 24.0” W × 22.5” D (610 × 572 mm) |
| DUT Area / User Space | 21.7” × 16.9” (551.2 × 429.3 mm) |
| Number of Devices | Up to 12 with ITC |
| Sockets | High-force, water-cooled (user specified) |
| Cooling Method | Water-cooled sockets |
A high-power burn-in with test system with individual temperature control per device, engineered for devices up to 1,000 watts. A turnkey automation solution that scales from a single cell to a full production line.
A single-board (one-slot) system with the same test electronics and device cooling as a full HPB-6. Primarily used for test development and board troubleshooting.
A powered workstation for moving BIB and regulator assemblies between your HPB-6 systems and EDS. The powered lift aligns to slot height and docks directly to the system, reducing manual handling.
A connected complete setup of automated loading, mobile robotics, and burn-in systems working as one. Cross platform software synchronizes every handoff, scaling from a single cell to full production.
Burn-in with Individual temperature control (ITC) is the most important development in burn-in technology.
Burn-in is the process that applies elevated temperatures and high voltages to accelerate conditions that will stress semiconductors during what is known as their infant mortality period.
Get The Complete Turnkey Solution For The HPB-6
