Applications / Reliability & Qualification

Reliability & Qualification

Reliability and qualification devices are integral to the development and performance of semiconductors in any industry and at any stage of the build process, from the factory to the end user. Burn-in with test is one of the most important tools for getting that answer right.

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Across every industry that relies on semiconductors, reliability and qualification devices serve as the last line of defense between the production floor and the end user. These devices are designed to validate device robustness, surface latent defects, and reduce the risk of early-life failures before products are released. Burn-in with test contributes to that effort by subjecting devices to controlled, sustained electrical and thermal stress, accelerating the failure mechanisms that might otherwise only appear after deployment, when the cost of discovery is far higher.

Key Specifications

  • Applicable across engineering qualification, early production screening, and ongoing reliability devices
  • Supports new device introductions, process node transitions, and risk-based screening
  • Burn-in conditions aligned to device characteristics and device reliability objectives
  • Configuration documentation available for qualification reporting and audit preparation

Key Statistics

$975B

Global semiconductor market in 2026

1.05T

Semiconductor units shipped in 2025

$2T

Projected global semiconductor market by 2036

Key Features & Benefits

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Burn-In Addresses What Other Tests Can't

Burn-in testing is a reliability screening process that stresses electronic components or systems under elevated temperatures and voltages, typically for several hours, to force early failures. It identifies infant mortality defects and errors before your devices are deployed in the field, enhancing long-term reliability.

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The Stakes of Skipping Early Screening

Make no mistake: devices with latent defects that aren’t tested properly in early-life screening in the production facility don’t fail there — they fail in the real world in the customer’s hands. This can leave them with failed tasks, malfunctioning equipment, or worse, human safety incidents.

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Controlled Stress Is What Makes Burn-In Meaningful

The value of burn-in in reliability and qualification programs comes down to one thing: the ability to apply controlled, repeatable electrical and thermal stress over a sustained period. That stress is what separates burn-in from functional testing; it’s not checking whether a device works once, it’s finding out whether it holds up again and again in all of its potential environments.

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A Consistent Approach as Technology Evolves

New process nodes, new packaging formats, and new device architectures all introduce new reliability concerns and considerations that need to be accounted for, unlike previously tested and vetted semiconductors in prior generations. Micro Control works with customers to review and adapt burn-in configurations at each transition, ensuring the approach stays calibrated to the actual reliability risks of the devices being tested.

Burn-In With Test as Part of a Complete Reliability Strategy

Whether you’re running qualification builds, managing an early production ramp, or establishing an ongoing screening device, Micro Control has the systems and expertise to support your reliability objectives.

Relevant Systems

HPB-5C

The HPB-5C is an industry standard, one of Micro Control's most proven, versatile burn-in with test system trusted by manufacturers worldwide. Air-cooled with individual temperature control per device, it keeps testing floors running dependably across legacy and current production.

LC-FLEX

A flexible, LC-2-compatible burn-in with test system with individual temperature control for devices up to 50 watts. A custom adapter board runs BIBs from other systems and manufacturers, bridging past, current, and future requirements.

LC-3

The LC-3 system is a production-ready burn-in with test system for logic, mixed signal, analog, and memory devices. Combines dynamic burn-in with test, expanded power and temperature control, and cold burn-in capability in one platform.

LC-2 V Series

A burn-in with test system designed to maximize your existing board infrastructure. An adapter-based approach lowers cost-of-test, shortens design cycles, and runs legacy and next-generation hardware together.

Learn More About Our Burn-In Solutions For Reliability Devices