High-Power Burn-In with Test System
The HPB-6 is an advanced, high-performance burn-in system capable of performing dynamic burn-in with test on extremely high-power (1000+ watt) devices. Temperature control on the HPB-6 is accomplished via device power feedback and has fuzzy logic control for stability. Water-cooled high-force sockets provide good thermal contact for efficient heat transfer.
| Target DUT Wattage | 1,000W |
| Available Power | 48 supplies, 4,560A, 7,440W |
| Max Power per BIB | 4,400W |
| High-Current Regulators | 24 per BIB — 250W, 175A, 0.3V–1.8V |
| Low-Current Regulators | 24 per BIB — 60W, 15A, 0.3V–4.0V |
| Vector Memory Depth | 64M standard, 128M optional |
| Scan Mode Rep-Rate | Up to 40MHz (up to 100MHz on 16 dedicated fast scan channels) |
| High-Frequency Clocks | 8 clocks, up to 350MHz, LVDS |
| BIB Slots | 16 |
| Pattern Zones | Up to 16 |
| I/O Channels | 128 formatted digital, plus 128 vector-driven-only |
| Test Resolution | 1.25 ns (8 on-the-fly timing sets) |
| Temp Channels per BIB | 12 individual |
| System DUT Capacity | 192 temperature-controlled DUTs |
| Temperature Limit | 150°C per DUT |
| Socket Cooling | Liquid-cooled with heater per DUT |
| System Cooling | Standalone chiller for DUT coolant |
Our automation solutions are designed and built along with a Taiwanese partner, or through another partner as needed, for HPB-6 integration. Automation increases throughput and cycle consistency while reducing manual handling and operator exposure, and providing continuous operation with repeatable precision.
The HPB-6 can be paired with a complete automation solution to handle AI, automotive, and advanced semiconductor devices through a production burn-in environment incorporating an automated guided vehicle (AGV), autonomous mobile robot (AMR), automatic loader-unloader (ALU), and the HPB-6. This complete setup creates a modular network working together for a complete turnkey automation solution; cross-platform software synchronizes all motion and communication, and scalable design supports single systems or entire production lines.
Designed by engineers and PCB designers experienced in multi-layer board layouts. Each HPB-6 burn-in board is built for the device under test and for the customer's specific requirements. The device size and complexity determine how many devices fit per burn-in board.
A single-board (one-slot) system with the same test electronics and device cooling as a full HPB-6. Primarily used for test development and board troubleshooting.
A powered workstation for moving BIB and regulator assemblies between your HPB-6 systems and EDS. The powered lift aligns to slot height and docks directly to the system, reducing manual handling.
A connected complete setup of automated loading, mobile robotics, and burn-in systems working as one. Cross platform software synchronizes every handoff, scaling from a single cell to full production.
Compare up to three Micro Control solutions to quickly narrow your options and identify which burn-in system best aligns with your device requirements, testing environment, and performance goals.
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Burn-in with Individual temperature control (ITC) is the most important development in burn-in technology.
Burn-in is the process that applies elevated temperatures and high voltages to accelerate conditions that will stress semiconductors during what is known as their infant mortality period.
Get The Complete Turnkey Solution For The HPB-6
