LC-3

High-Power Burn-In with Test System

50 W

Wattage

2025

System Released

1536

DUTs Per System

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Micro Control LC-3 industrial testing machine with its main access door open, showing internal component racks, a control monitor, and a keyboard.

Sophisticated Burn-In System Ready for Production Requirements

The LC-3 is a sophisticated burn-in-with-test system that manages advanced requirements through its ability to perform dynamic burn-in with test. The LC-3 burn-in system is designed for production burn-in of logic, mixed signal, analog, and memory devices. With 50% more power supplies than an HPB-5C, double the number of temperature control channels than an LC-2, and up to 32 user-defined independent pattern zones, the LC-3 is the future of burn-in.

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Technical Specifications

POWER SPECIFICATIONS

Target DUT Wattage	20W (50W for fewer devices)
Available Power	24 supplies, 544A, 22,400W
Max Power per BIB	1,000W
High-Current Regulators	16 per BIB — 240W, 60A, 0.5V–9.5V
Low-Current Regulators	8 per BIB — 40W, 8A, 0.25V–5.0V

MEMORY & PATTERN CAPACITY

Vector Memory Depth	4M standard, 8M optional
Scan Mode Rep-Rate	Up to 40MHz (up to 100MHz on 16 dedicated fast scan channels)
High-Frequency Clocks	8 clocks, up to 350MHz, LVDS

SYSTEM CAPACITY & I/O

BIB Slots	32
Pattern Zones	Up to 8
I/O Channels	128 formatted digital, plus 128 vector-driven-only channels
Test Resolution	1.25 ns (8 on-the-fly timing sets)
BIB Compatibility	Adaptable to industry standard BIBs via custom adapter board

THERMAL MANAGEMENT

Temp Channels per BIB	48 individual
System DUT Capacity	1,536 temperature-controlled DUTs
Temperature Limit	175°C per DUT
Socket Cooling	Air-cooled chamber with heater per DUT

A large green circuit board populated with a grid of square black integrated circuit sockets and a metal handle.

Adapter Boards

A unique feature of the LC-3 is the easily replaceable adapter board. The adapter board allows burn-in boards of varying sizes and connector arrangements to be plugged into the system backplane, making it possible for the devices on each burn-in board to be stressed and tested during the burn-in cycle. Custom circuitry can be added to the adapter board if needed for an application.

LC-3 Burn-In Boards

Designed by engineers and PCB designers experienced in multi-layer board layouts. Each LC-3 board is designed for the device under test and the customer's specific requirements. The device size and complexity determine how many devices will fit per board.

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LC-3 EDS

A single-board (one-slot) system with the same test electronics and device cooling as a full LC-3. Primarily used for test development and board troubleshooting.

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Tall mobile storage rack with multiple horizontal shelving tiers on casters.

LC-3 Burn-In Board Carts

The LC-3 BIB cart streamlines the process of loading and unloading burn-in boards into and from an LC-3 H1 system. This style of cart is designed to be rolled from location to location. When docking to a system, the cart feet must be guided into the docking bracket and the cart pushed in so that the latch mounted on the cart engages with the latch mounted above the oven door. Once the cart is latched into the system, pneumatic cylinders engage and move the cart into positing for loading and unloading burn-in boards from the LC-3.

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Micro Control HPB-8 industrial testing system with two open testing racks, a control panel, and a mounted computer monitor and keyboard.

Standalone Automation

Individual automation modules that run on their own or attach to a single system, a way to add automated handling without committing to a full line. A flexible entry point that can grow into the complete setup.

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System Comparison

Compare up to three Micro Control solutions to quickly narrow your options and identify which burn-in system best aligns with your device requirements, testing environment, and performance goals.

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POWER SCALE

Power Scale

Max

PERFORMANCE SPECS

Target DUT Wattage

BIB slots

Individual Temperature Control Channels per BIB

System Capacity of Temperature Controlled DUTs

DUT Temperature Control Mechanism

APPLICATIONS

ASIC

Automotive

Communications

Defense

Reliability

Smartphones

Why Choose the LC-3

Production-Ready Dynamic Burn-In

Built for production burn-in of logic, mixed-signal, analog, and memory devices.

Highest Temperature Limit In The Portfolio

Supports stressing up to 175°C per device.

Expanded Temperature Control

48 individual temperature channels per BIB and a system capacity of 1,536 temperature-controlled DUTs.

Adaptable To Industry-Standard Bibs

Connects to industry-standard burn-in boards through a custom adapter board.

Featured Resources

Why Individual Temperature Control Burn-In

Burn-in with Individual temperature control (ITC) is the most important development in burn-in technology.

What is Burn-In?

Burn-in is the process that applies elevated temperatures and high voltages to accelerate conditions that will stress semiconductors during what is known as their infant mortality period.

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