HPB-8

High-Power Burn-In with Test System

2000+ W
Wattage
2025
System Released
384
DUTs Per System
Micro Control HPB-8 industrial testing equipment with two large racks of trays, a touch screen interface, and an attached computer monitor with keyboard.

Advanced High-Performance Dynamic Burn-In

The HPB-8 is an advanced, high-performance burn-in with test system that features individual temperature control (ITC) for each device under test. The HPB-8 is capable of performing dynamic burn-in with test on extremely high-power devices over 2,000 watts, and keeping those devices at an optimum temperature for stressing and testing during the burn-in cycle. Designed for automation, the HPB-8 reduces the handling of expensive artificial intelligence (AI) processors and chips during burn-in cycles. And the HPB-8 is Micro Control’s most powerful and energy-efficient model to date.

Technical Specifications

POWER SPECIFICATIONS
Target DUT Wattage 2,000W
Available Power 24 supplies, 4,560A, 7,440W
Max Power per BIB 4,400W
High-Current Regulators 16 per BIB — 350W, 350A, 0.3V–1.8V
Low-Current Regulators 8 per slot — 60W, 16A, 0.3V–4.0V (shared across both BIBs in slot)
MEMORY & PATTERN CAPACITY
Vector Memory Depth 64M standard, 128M optional
Scan Mode Rep-Rate Up to 40MHz (up to 100MHz on 16 dedicated fast scan channels per slot, shared to both BIBs)
High-Frequency Clocks 8 clocks, up to 350MHz, LVDS
SYSTEM CAPACITY & I/O
BIB Slots 16 slots, 2 BIB per slot
Pattern Zones Up to 16
I/O Channels 128 formatted digital per BIB, plus 128 vector-driven-only per slot (shared to both BIBs)
Test Resolution 1.25 ns (8 on-the-fly timing sets)
THERMAL MANAGEMENT
Temp Channels per BIB 12 individual
System DUT Capacity 384 temperature-controlled DUTs
Temperature Limit 150°C per DUT
Socket Cooling Liquid-cooled with heater per DUT
System Cooling Standalone chiller for DUT coolant
An automated assembly machine with mechanical arms pressing down on components of a circuit board.

The HPB-8 is Built as a Standalone Automation Solution

The HPB-8 is built for integrating burn-in automation for AI and advanced semiconductor production. Cross-platform software synchronizes motion and communication across every component, scaling from a single system to a full production line.

The complete setup can include:

  • HPB-8 burn-in system
  • Automatic Loader-Unloader (ALU)
  • Automated Guided Vehicle (AGV)
  • Autonomous Mobile Robot (AMR)
  • Storage Rack

The result: higher throughput, consistent cycle times, reduced manual handling, and continuous operation with repeatable precision. Engineered by Micro Control Company for autonomous, predictable, data-driven testing at scale.

HPB-8 Burn-In Boards

Designed by engineers and PCB designers experienced in multi-layer layouts. Each HPB-8 burn-in board is designed for the device under test and for the customer's specific requirements. Device size and complexity determine how many device fit per board.

HPB-8 EDS

A single-board (one-slot) system with the same test electronics and device cooling as a full HPB-8. Primarily used for test development and board troubleshooting.

HPB-8 Mobile Workstation

A powered workstation for moving BIB and regulator assemblies between your HPB-8 systems and EDS. The powered lift aligns to slot height and docks directly to the system, reducing manual handling.

Standalone Automation

Individual automation modules that run on their own or attach to a single system, a way to add automated handling without committing to a full line. A flexible entry point that can grow into the complete setup.

System Comparison

Compare up to three Micro Control solutions to quickly narrow your options and identify which burn-in system best aligns with your device requirements, testing environment, and performance goals.

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POWER SCALE
Power Scale
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PERFORMANCE SPECS
Target DUT Wattage
BIB slots
Individual Temperature Control Channels per BIB
System Capacity of Temperature Controlled DUTs
DUT Temperature Control Mechanism
APPLICATIONS
AI
ASIC
Automotive
Communications
Defense
Reliability
Smartphones

Why Choose the HPB-8

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Highest Power In The Portfolio

Performs dynamic burn-in with test on devices over 2,000 watts, our most powerful system to date.

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Individual Temperature Control At Scale

384 temperature-controlled DUTs, each held at an optimum temperature with liquid-cooled sockets and a 150°C limit.

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Built For Automation

Designed as a standalone automation solution for AI and advanced semiconductor production, reducing handling of high-value processors.

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Powerful And Efficient

Our most energy-efficient system, engineered for continuous, data-driven testing at scale.