Application-Specific Integrated Circuit (ASIC) & Custom Silicon

Unlike standard semiconductor products, ASICs often operate near their design limits, incorporate novel architectures, and may have no direct equivalent in the market. That uniqueness is what makes them valuable, and it’s also what makes early-life failures so costly. A field failure in a custom silicon device can mean redesigns, root-cause investigations, and device delays that no organization wants.

Off-the-shelf burn-in approaches aren’t always appropriate for custom silicon. Micro Control’s engineering team works with ASIC customers to define burn-in conditions based on actual device characteristics, power dissipation, electrical behavior, intended operating environment, rather than applying generic settings that may not fit the application and intended operating environment to conduct the most thorough and valuable testing possible, rather than applying generic setting that may not appropriately test the application’s limits.

ASIC devices often involve burn-in at two distinct stages: engineering builds during qualification and early production lots during the manufacturing ramp. Micro Control’s systems are designed to support both contexts, with the configurability to adapt as device designs mature and volume requirements evolve.

Custom silicon doesn’t stand still; next-generation designs introduce new power profiles, new packaging, and new operating requirements. Micro Control’s burn-in systems are designed with that reality in mind, providing the configurability to adapt to new device requirements without requiring a full system replacement.