LC-FLEX BIB Cart for Burn-In with Test
A manually operated mobile cart for securely transporting BIBs between your LC-FLEX systems and EDS.
Technical Specifications
LC-FLEX Single Wide
| PCB Size | 12.3” x 24” (312.4 mm x 609.6 mm) |
| DUT Area / User Space | 6.7” x 22.8” (170.1 mm x 579.1 mm) |
| Number of Devices | Up to 84 depending on size & complexity |
| Sockets | High-temp, user specified |
| Cooling Method | User specified |
LC-FLEX Double Wide
| PCB Size | 22.2” x 24” (563.9 mm x 609.6 mm) |
| DUT Area / User Space | 16.6” x 22.8” (421.6 mm x 579.1 mm) |
| Number of Devices | Up to 84 depending on size & complexity |
| Sockets | High-temp, user specified |
| Cooling Method | User specified |
LC-FLEX
A flexible, LC-2-compatible burn-in with test system with individual temperature control for devices up to 50 watts. A custom adapter board runs BIBs from other systems and manufacturers, bridging past, current, and future requirements.
LC-Flex Burn-In Boards
Designed by engineers and PCB designers experienced in multi-layer board layouts. Each LC-FLEX board is designed for the device under test and the customer's specific requirements. The device size and complexity determine how many fit per board.
LC-FLEX EDS
A single-board (one-slot) system with the same test electronics and device cooling as a full LC-FLEX. Primarily used for test development and board troubleshooting.
Integrated Automation
A connected complete setup of automated loading, mobile robotics, and burn-in systems working as one. Cross platform software synchronizes every handoff, scaling from a single cell to full production.
Featured Resources
Why Individual Temperature Control Burn-In
Burn-in with Individual temperature control (ITC) is the most important development in burn-in technology.
What is Burn-In?
Burn-in is the process that applies elevated temperatures and high voltages to accelerate conditions that will stress semiconductors during what is known as their infant mortality period.
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