LC-2 BIB Cart for Burn-In with Test
A manually operated mobile cart for securely transporting BIBs.
Technical Specifications
HANDLINGLC-2 Single Wide
| PCB Size | 12.3” x 24” (312.4 mm x 609.6 mm) |
| DUT Area / User Space | 6.7” x 22.8” (170.1 mm x 579.1 mm) |
| Number of Devices | Up to 48 depending on size & complexity |
| Sockets | High-temp, user specified |
| Cooling Method | User specified |
LC-2 Double Wide
| PCB Size | 22.2” x 24” (563.9 mm x 609.6 mm) |
| DUT Area / User Space | 16.6” x 22.8” (421.6 mm x 579.1 mm) |
| Number of Devices | Up to 48 depending on size & complexity |
| Sockets | High-temp, user specified |
| Cooling Method | User specified |
LC-2 V Series
A burn-in with test system designed to maximize your existing board infrastructure. An adapter-based approach lowers cost-of-test, shortens design cycles, and runs legacy and next-generation hardware together.
LC-2 Burn-In Boards
Designed by engineers and PCB designers experienced in multi-layer board layouts. Each LC-2 board is built for the device under test and the customer's specific requirements. The device size and complexity determine how many devices will fit per board.
LC-2 PSS
A single-board (one-slot) system with the same test electronics and device cooling as a full LC-2. Primarily used for test development and board troubleshooting.
Integrated Automation
A connected complete setup of automated loading, mobile robotics, and burn-in systems working as one. Cross platform software synchronizes every handoff, scaling from a single cell to full production.
Featured Resources
Why Individual Temperature Control Burn-In
Burn-in with Individual temperature control (ITC) is the most important development in burn-in technology.
What is Burn-In?
Burn-in is the process that applies elevated temperatures and high voltages to accelerate conditions that will stress semiconductors during what is known as their infant mortality period.
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